Machining cycles
Highlights
- Integrates new machining technologies
- Expands machine capability
- Simplifiys complicated programming tasks
ULTRASONIC axialGRINDING
- Grinding of rotationally symmetrical structures and in particular 3D contours in hard-brittle materials with maximum performance
- Production of bearing rings, wafer chucks, microwave windows for many areas of the semiconductor industry, optics and technical ceramics
- Grinding of spheres possible
Highlights
Customer Benefits
- Simple programming of complex 3D contours* and rotationally symmetrical geometries using intuitive operator screens
- Selection of different cutting edges and setting angles of the grinding tool
- Automatic adjustment of the tool contact point depending on the contour
*Only the ULTRASONIC axialGRINDING cycle can grind 3D contours. The standard grinding cycle from DMG MORI for FDS machines cannot grind 3D contours.
Left : Different tool settings for changing the engagement point of the of the ULTRASONIC grinding tools. / Right : Simple setup of the grinding tools including edge radii.
Sealing ring, SiC
Ring, quarts glass
Resonator, quartz glass
ULTRASONIC microDRILL
- With ULTRASONIC 2nd Generation and 32.000 rpm for micro drilling with highest process safety
- Fully integrated regulation of the drilling force in the preset- spindle down to smaller 1 N – independent from the z-axis of the machine
- ICS with seperate fine filtration and flow rate control starting from 1 l/min
- Automatic ejector mechanism for drill cores from the diamond hollow drills
Highlights
Customer Benefits
- Drilling diameter from 0.1 mm – 2.0 mm
- Several thousand holes per part possible without manual interaction
- Applicable for diamond hollow drills and spiral drills
Left : Fully integrated into the display in the CELOS SideScreen / Right : Precise regulation of the drilling force incl.